Title of the product detail
The product detail page introduction is displayed at the top of the product detail page. High-density interconnection, stable performance andexcellent reliability for complex electronic products.
Product images
Key Specifications
| Layers | 1 – 20 Layers | Min. Hole Size (Laser) | 0.10 mm (4 mil) |
|---|---|---|---|
| Board Thickness | 0.2 – 6.0 mm | Aspect Ratio | Up to 10 : 1 |
| Finished Copper Thickness | 0.5 – 8.0 oz | Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Min. Line / Space | 3 / 3 mil | Solder Mask Color | Green, Blue, Black, White, Red, Yellow |
| Min. Line Width (Inner Layer) | 2.5 mil | Silkscreen Color | White, Black, Yellow |
| Min. Line Width (Outer Layer) | 3 mil | Material | FR-4, High Tg, Rogers, Aluminum, Polyimide, PTFE, etc. |
| Min. Hole Size (Drilled) | 0.15 mm (6 mil) |
Product Features
Support 1-20 layers for complex and high-density applications.
Fine lines and small viaensure high wiring density and space saving.
Strict process control for excelient elecbical performance and relliabliny.
Advanced manufacturing equipment ensures high precision and tight tolerances.
Various materials, thiclness, copper weight and surface finishes avallle.
100% E-test, AO1 and visual inspection to ensure consis tent quality.
